- [公司新闻]ECS-TXO-16CSMV4超紧凑型TCXO晶振2026年09月30日 08:56
ECS-TXO-16CSMV4超紧凑型TCXO晶振
在当下硬件设计"每一寸空间必争"的行业现状下,器件封装尺寸直接决定了产品的轻薄度与集成度.ECS-TXO-16CSMV4采用行业先进的微型陶瓷贴片封装工艺,整机尺寸仅为1.6mm×1.2mm×0.56mm,是同精度TCXO产品中体积最小的型号之一.相较于传统2.0×1.6mm,3.2×2.5mm常规晶振,体积缩减超40%以上,能够完美适配各类超薄,微型,高密度PCB布局场景.
器件采用标准4焊盘陶瓷基底封装,结构稳固,抗震抗摔,耐高温,抗氧化,适配全自动SMT贴片量产工艺,兼容高速贴片机贴装,不易出现虚焊,偏移,损坏等量产问题.同时产品达到MSL1最高湿度敏感等级,无防潮储存严苛限制,仓储管理简单,极大降低了企业量产生产管控成本,适配大批量工业化生产需求.全程符合RoHS无铅环保标准,合规对接国内外各类电子产品出口认证要求.16csmv4超紧凑型tcxo晶振：1.6×1.2mm削波正弦波高精度时钟解决方案"}}},"align":"","revision_container_id":"doxc6goczenzev8k3s7huc9xg0g","status":{"streaming":{"enabled":false,"expired_at":"1790729714","is_create_command":true,"operator_id":"7672297316216213820","source":1}},"type":"page","comments":[],"locked":false,"author":"7672297316216213820"}}},"payloadmap":{"qrhqfdkswdoosfcjdvfcclvangh":{"level":1},"rjrhfvlaidpw3gckuggchqeenbg":{"level":1}},"extra":{"channel":"saas","pasterandomid":"9c7b6234-dd24-45ef-bb21-82017dff37d3","mention_page_title":{},"external_mention_url":{},"isequalblockselection":true},"iskeepquotecontainer":false,"selection":[{"id":6,"type":"text","selection":{"start":0,"end":193},"recordid":"qrhqfdkswdoosfcjdvfcclvangh"},{"id":7,"type":"text","selection":{"start":0,"end":177},"recordid":"rjrhfvlaidpw3gckuggchqeenbg"}],"pasteflag":"5695bf82-c2c4-44c9-85ca-0025d4ff9a0e"}"="" data-lark-record-format="docx/record" class="lark-record-clipboard" style="font-size:medium">- 阅读（71）
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